187 2.plating results

? 2 Gold Plating vs Gold Flash Question: J-STD-001 section 4.5.1 requires gold removal for through-hole component leads with gold thickness more than 2.54micrometer

| https://www.eptac.com/wp-content/uploads/2016/04/eptac_04_20_16.pdf

Key Tips & Techniques for Taking Care of Solder Iron Tips 1 2 Tip Construction • Copper Core •  Iron Plating • Nickel plating over the Iron

| https://www.eptac.com/wp-content/uploads/2014/11/eptac_11_19_14.pdf

China Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/china-fab-quote/

* Materials FR4(130Tg) FR4(170Tg) FR406(180Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating ENIG1U" ENIG2U" ENIG3U" ENIG4U" ENIG5U" Immersion Tin Immersion Silver HASL (Leaded

Imagineering, Inc.

Taiwan Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-taiwan/

* Materials FR4(130Tg) FR4(170Tg) FR406(180Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating ENIG1U" (Immersion Gold) ENIG2U" (Immersion Gold) ENIG3U" (Immersion Gold) ENIG4U" (Immersion Gold) ENIG5U" (Immersion Gold) Immersion Tin Immersion Silver HASL

Imagineering, Inc.

Assembly Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/assembly-quote/?cpn=0

* Select One 1 2 3 4 5 6 8 Dimensions * Materials FR4(130Tg) FR4(170Tg) FR406(180Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating ENIG1U" (Immersion Gold) ENIG2U" (Immersion Gold) ENIG3U" (Immersion Gold) ENIG4U" (Immersion Gold) ENIG5U" (Immersion Gold

Imagineering, Inc.

China Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-china/

* Materials FR4(130Tg) FR4(170Tg) FR406(180Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating ENIG1U" (Immersion Gold) ENIG2U" (Immersion Gold) ENIG3U" (Immersion Gold) ENIG4U" (Immersion Gold) ENIG5U" (Immersion Gold) Immersion Tin Immersion Silver HASL

Imagineering, Inc.

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/

: We have a situation where we have gold boards which accept gold wire bonding, but are failing a pull test. Other than making sure the boards are clean with a quick trip into the degreaser, is there any other way to refresh gold plating to help these boards pass pull testing

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test

: We have a situation where we have gold boards which accept gold wire bonding, but are failing a pull test. Other than making sure the boards are clean with a quick trip into the degreaser, is there any other way to refresh gold plating to help these boards pass pull testing? Answer

USA Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/

* Materials FR4(130Tg) FR4(170Tg) FR4(180Tg) from Taiwan or China Copper Weight 1 oz 2 oz 3 oz 4 oz Cu from Taiwan or China Finish Plating ENIG1U" (Immersion Gold) HASL (Leaded

Imagineering, Inc.

eptac_05_19_10.PPT

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf

. The webinar will begin shortly. 2 Attendee Quick Reference Control Panel Features: Once you have joined our Webinar, you will see this GoToWebinar Control Panel and Grab Tab