PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/decimal-precision-in-physical-description_topic298_post482.html
(DFN 4 Pins), 0.75mm pitch;4 pin,1.20mm L X 0.775mm W X 0.40mm H body DIOMELF3515 Diode, Metal Electrode Face (MELF);3.50mm L X 1.525mm Dia RESMELF3515 Resistor, Metal Electrode Face
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic298&OB=ASC.html
(DFN 4 Pins), 0.75mm pitch;4 pin,1.20mm L X 0.775mm W X 0.40mm H body DIOMELF3515 Diode, Metal Electrode Face (MELF);3.50mm L X 1.525mm Dia RESMELF3515 Resistor, Metal Electrode Face
PCB Libraries, Inc. | https://www.pcblibraries.com/products/fpx/3D-STEP_SM-Passive.asp
3D STEP - Surface Mount Passive LOGIN Downloads About Footprint Expert Parts Forum Distributors Sales & Support About Us News History Altium Designer CircuitStudio P-CAD Allegro OrCAD Layout OrCAD PCB Board Station PADS Standard PADS Professional Xpedition VX CADSTAR CR-5000 / 8000 eCADSTAR 3D STEP
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/3D-STEP_SM-Passive.asp
3D STEP - Surface Mount Passive LOGIN Downloads About Footprint Expert Parts Forum Distributors Sales & Support About Us News History Altium Designer CircuitStudio P-CAD Allegro OrCAD Layout OrCAD PCB Board Station PADS Standard PADS Professional Xpedition VX CADSTAR CR-5000 / 8000 eCADSTAR 3D STEP
| http://etasmt.com/cc?ID=te_news_industry,5361&url=_print
. The liquidus temperature depending on the application.The Wave soldering electrode: successful wave soldering, liquid temperature should be lower than 265
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-mesoshere-plasma-systems-enable-very-high-throughput-processsing
. Plasma improves spun-on film adhesion and cleans metallic bond pads. For wafer etching, the MesoSPHERE plasma system descums wafers of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhances adhesion of wafer
| http://etasmt.com:9060/te_news_industry/2013-07-03/5361.chtml
. The liquidus temperature depending on the application.The Wave soldering electrode: successful wave soldering, liquid temperature should be lower than 265
| http://etasmt.com/te_news_industry/2013-07-03/5361.chtml
. The liquidus temperature depending on the application.The Wave soldering electrode: successful wave soldering, liquid temperature should be lower than 265
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/products/plasma-treatment-systems/sphere-wafer-series
. Plasma also improves spun-on film adhesion and cleans metallic bond pads. Wafer Etching - Plasma systems descum wafer of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove
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