ASCEN Technology | https://www.ascen.ltd/Blog/machine/online_loader_unloader/438.html
Magazines.The unit loads the production line automatically by pushing PCBA out of a magazine onto the conveyor of the down-stream machine Description: 1. Solid and stable design
ASCEN Technology | https://www.ascen.ltd/Blog/machine/online_loader_unloader/444.html
Magazines.The unit loads the production line automatically by pushing PCBA out of a magazine onto the conveyor of the down-stream machine Description: 1. Solid and stable design
ASCEN Technology | https://www.ascen.ltd/Products/pcb_loader_unloader/246.html
. 460 x 535mm maximum PCB or pallet dimensions. Touchscreen control. Two models to choose from. Features: 1. Solid and stable design. 2. PLC control system. 3
ASCEN Technology | https://www.ascen.ltd/Products/pcb_loader_unloader/249.html
. Features: 1. Solid and stable design. 2. PLC control system. 3. Light touch LED membrane switch or touch screen control panel options available. 4
ASCEN Technology | https://www.ascen.ltd/Products/pcb_loader_unloader/261.html
. 460 x 535mm maximum PCB or pallet dimensions. Touchscreen control. Two models to choose from. Description: 1. Solid and stable design
ASCEN Technology | https://www.ascen.ltd/Products/pcb_loader_unloader/264.html
. Solid and stable design. 2. PLC control system. 3. Light touch LED membrane switch or touch screen control panel options available
| https://pcbasupplies.com/utility-cart-36w-x-18d-x-37-1-2h-3-galvanized-solid-shelves-1200-lb-capacity-2-u-shaped-chrome-plated-handles-open-base-donut-bumpers-4-5-polyurethane-swivel-casters-2-with-brakes-nsf/
» Bussing Utility Transport » Metal » Utility Cart, 36″W x 18″D x 37-1/2″H, (3) galvanized solid shelves, 1200 lb. capacity, (2) “U” shaped chrome plated handles, open base, donut bumpers, (4) 5
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
. Layer Count 50 Max. Working Panel Size 21" x 31" Max. Board Thickness .300" Min. Board Thickness 0.16"(6L) Min. Line/Space • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) Warpage .001" / sq. in. BGA Pitch 0.20mm Layer to Layer Registration 3 mil
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/
. Layer Count 50 Max. Working Panel Size 21" x 31" Max. Board Thickness .300" Min. Board Thickness 0.16"(6L) Min. Line/Space • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) Warpage .001" / sq. in. BGA Pitch 0.20mm Layer to Layer Registration 3 mil
| https://www.wesource.com/electronic-components/mini-circuits-assorted-electronics-lot-of-10-id-53862-4/22/
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