PCB Libraries, Inc. | https://www.pcblibraries.com/forum/collapsing-vs-noncollapsing-bga-balls_topic1868_post7826.html
0.50 mm pitch or less. There are various Chip Scale Packages where the mfr. calls the package a BGA but instead of a Ball there is only a bump
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/collapsing-vs-noncollapsing-bga-balls_topic1868.html
0.50 mm pitch or less. There are various Chip Scale Packages where the mfr. calls the package a BGA but instead of a Ball there is only a bump
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1868&OB=ASC.html
0.50 mm pitch or less. There are various Chip Scale Packages where the mfr. calls the package a BGA but instead of a Ball there is only a bump
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
”, SMTAI Conference Proceedings [9] Investigation Specifics: 680 I/O Plastic BGA, daisy chained, 35x35mm package, 1.0mm pitch, 0.635 (25 mil) diameter solderball
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
”, SMTAI Conference Proceedings [9] Investigation Specifics: 680 I/O Plastic BGA, daisy chained, 35x35mm package, 1.0mm pitch, 0.635 (25 mil) diameter solderball
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_aoi_cyberopticsse200.html
% 3D inspection of 13 x 13, 50 mil pitch BGA site in 8 seconds, 1005 inspection 0f 160-Lead, 20 mill pitch QFA site takes approximately 12 seconds Location
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_aoi_cyberopticsse200.html
% 3D inspection of 13 x 13, 50 mil pitch BGA site in 8 seconds, 1005 inspection 0f 160-Lead, 20 mill pitch QFA site takes approximately 12 seconds Location
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_aoi_cyberopticsse2001.html
% 3D inspection of 13 x 13, 50 mil pitch BGA site in 8 seconds, 1005 inspection 0f 160-Lead, 20 mill pitch QFA site takes approximately 12 seconds Fully Functional - Excellent Condition Manuals
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
. Layer Count 50 Max. Working Panel Size 21" x 31" Max. Board Thickness .300" Min. Board Thickness 0.16"(6L) Min. Line/Space • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) Warpage .001" / sq. in. BGA Pitch 0.20mm Layer to Layer Registration 3 mil
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/
. Layer Count 50 Max. Working Panel Size 21" x 31" Max. Board Thickness .300" Min. Board Thickness 0.16"(6L) Min. Line/Space • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) Warpage .001" / sq. in. BGA Pitch 0.20mm Layer to Layer Registration 3 mil
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