Partner Websites: 90/10 tin-lead (Page 5 of 52)

Leadfree

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf

• The true process window for Lead Free Solder is 10 - 20°C less than standard eutectic tin lead • Delta T on the PCB becomes critical

Heller Industries Inc.

EPTAC '05 Data Sheets

| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_600-CSE.pdf

• Base Material Surface and Subsurface • Solder Coatings and Fused Tin Lead • Holes–Plated Through and Unsupported • Printed Contacts • Marking • Solder Mask • Pattern Definition

LED Reflow Oven Conditions and Temperature Time Control-News-Reflow oven,SMT Reflow Soldering Oven-c

| http://etasmt.com/te_news_bulletin/2020-10-08/19761.chtml

. Regardless of how to set the recommended temperature curve for SMD lead-free reflow soldering, the maximum temperature should not exceed 10 seconds at 260

CF8 Documentation Package

GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf

CF-8 Precision Axial Lead Former 04/02/07 iii Revisions Version 1.0 release. All undated pages. Version 2.0 release. All pages dated 12/01/90. Version 2.1 release

GPD Global

ASCEN solder dross separator-PCB magazine loader,PCB turn conveyor,pcb conformal coating machine,PCB

ASCEN Technology | https://www.ascen.ltd/Products/solder_dross_separator/511.html

Blog Solution machine News PCB conveyor system Video Channel PCB conveyor transporter PCB depaneling machine PCB loader unloader PCB conformal coating system Component lead former Component insertion

ASCEN Technology

CF8 Documentation Package

GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf

CF-8 Precision Axial Lead Former 04/02/07 iii Revisions Version 1.0 release. All undated pages. Version 2.0 release. All pages dated 12/01/90. Version 2.1 release

GPD Global

Quality Requirements and Formation Process of PCB Reflow Oven Joints-News-Reflow oven,SMT Reflow Sol

| http://etasmt.com/cc?ID=te_news_bulletin,18961&url=_print

. The main components of general tin-lead solder are tin and lead, which are relatively low in strength. So in order to increase its strength as much as possible, we are soldering Usually need to increase the welding area according to the actual situation, or use it for the lead of the component to be welded

Quality Requirements and Formation Process of Reflow Solder Joints-News-Reflow oven,SMT Reflow Solde

| http://etasmt.com/cc?ID=te_news_bulletin,19361&url=_print

. The main components of general tin-lead solder are tin and lead, which are relatively low in strength. Therefore, in order to increase its strength as much as possible, we are soldering Usually need to increase the welding area according to the actual situation, or use it for the lead of the component to be welded

CF9 Documentation Package

GPD Global | https://www.gpd-global.com/pdf/lead-former/CF9-Doc-Package-901-1-01.pdf

Die, 2 Lead Radial, Lock-In Stand-Off 4A Die, 2 Lead Radial, Spreading 4B Die, 2 Lead Radial, Reducing 5 Knife 7 * Die, 2 Lead Radial, 90° Bend 8A Die, 2 Lead Radial, Spreading, Lock-In Stand-Off 8B Die, 2 Lead Radial, Reducing, Lock-In Stand-Off 10 Die

GPD Global


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