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Solder Joint Reliability -SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> SMT Technical Solder Joint Reliability
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
], which is the major wear-out failure mode and major source of failure for surface mount (SMT) components in electronic assemblies [8]. A specific type of voiding called planar microvoiding has been shown to lower reliability either by effectively reducing the attachment area or by weakening the solder in regions of the solder joint
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
], which is the major wear-out failure mode and major source of failure for surface mount (SMT) components in electronic assemblies [8]. A specific type of voiding called planar microvoiding has been shown to lower reliability either by effectively reducing the attachment area or by weakening the solder in regions of the solder joint
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