10 ability to identify smt defects using ipc-610 results

Explorer™ one

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/explorer-one

detector allows you to easily navigate samples and identify defects quickly. Easily ensure IPC-A-610 and IPC-7095 compliance with in-built tools for dimension measurement, BGA void analysis, bump diameter and roundness and through hole filling

ASYMTEK Products | Nordson Electronics Solutions

•  I have always had in the back of my head that burnt flux is a defect for all class 3 assemblies. But upon further review I have not been able to identify the specific section of the IPC-A-610F standard which identifies burnt flux as an acceptable or defect condition

| https://www.eptac.com/wp-content/uploads/2016/08/eptac_08_17_16.pdf

•  I have always had in the back of my head that burnt flux is a defect for all class 3 assemblies. But upon further review I have not been able to identify the specific section of the IPC-A-610F standard which identifies burnt flux as an acceptable or defect condition

| https://www.eptac.com/wp-content/uploads/2021/11/eptac_08_17_16.pdf

3 Things You Should Know About Lead-Free Soldering - Blackfox

Blackfox Training Institute, LLC | https://www.blackfox.com/3-things-you-should-know-about-lead-free-soldering/

3 Things You Should Know About Lead-Free Soldering - Blackfox Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001

Blackfox Training Institute, LLC

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys

Heller Industries Inc.

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys

Heller Industries Inc.

Calendar of Events

Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm

defect level against a process stage or a specific product compared against a known number of opportunities for defects to occur. There are IPC and IEC documents and procedures which do exist to monitor a process. This webinar will show how to implement a

Surface Mount Technology Association (SMTA)

Webinars

Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/

used method of illustrating yield is Part Per Million (PPM) Defective. This provides a measure of the defect level against a process stage or a specific product compared against a known number of opportunities for defects to occur. There are IPC and IEC

Surface Mount Technology Association (SMTA)

Webinars and Webtorials

Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm

used method of illustrating yield is Part Per Million (PPM) Defective. This provides a measure of the defect level against a process stage or a specific product compared against a known number of opportunities for defects to occur. There are IPC and IEC

Surface Mount Technology Association (SMTA)