Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
., Sandia National Laboratories " Predicting the Reliability of Package-on-Package-on-Package (PoPoP) Interconnections Based on Accelerated Aging Experiments and Computational Modeling " 2015: Paul Vianco, Ph.D
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5052
) as a result of the coarsening of intermetallic phases over time. Recent studies have shown that the addition of bismuth (Bi) to the alloy results in superior performance over SAC and Sn-Pb in accelerated thermal cycling (ATC
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4722
. Thus, behaviors of Cu pillar packages during Accelerated Thermal Cycling (ATC) were examined. Correlations between the shear strength and microstructure of Cu pillars were examined for different solder compositions, and for different aging times
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
. Tuttle, Cree, Inc. High Power LED Solder Joint Reliability Session 1 - Predicting Component Life + Under harsh environmental conditions like corrosion, radiation, high temperature and vibration, the aging of components is drastically accelerated. Dr
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
., Eriko Furuya, Katsuhisa Tanabe, and Shigeo Hashimoto Abstract 31-1 Accelerated Life Testing Solder Reliability in Combined Environments
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. But too thick an intermetallic layer has an adversely effect because it is generally the most brittle part of the solder joint. Compared to lead-based solders, SnAgCu solders require a higher reflow temperature which leads to accelerated diffusion rates
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
. But too thick an intermetallic layer has an adversely effect because it is generally the most brittle part of the solder joint. Compared to lead-based solders, SnAgCu solders require a higher reflow temperature which leads to accelerated diffusion rates
