Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218
: SMTA International Abstract: The Pb-free solder joint attachment reliability of two Quad Flat No-Lead (QFN) packages with different body sizes and die to package ratios (DPR
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
, “Variations in Thermal Cycling Response of Pb-free Solder Due to Isothermal Preconditioning,” Proceedings of SMTAI 2011, 641-654, Fort Worth, TX, October 2011. [8] Werner Engelmaier, “Surface Mount Solder Joint Long- Term Reliability: Design, Testing
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
, “Variations in Thermal Cycling Response of Pb-free Solder Due to Isothermal Preconditioning,” Proceedings of SMTAI 2011, 641-654, Fort Worth, TX, October 2011. [8] Werner Engelmaier, “Surface Mount Solder Joint Long- Term Reliability: Design, Testing
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
., Eriko Furuya, Katsuhisa Tanabe, and Shigeo Hashimoto Abstract 31-1 Accelerated Life Testing Solder Reliability in Combined Environments
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. Aspandiar, “Voids in Solder Joints”, SMTAI Conference Proceedings, 2006. 5. D. Banks et al, “The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability”, Surface Mount International Conference, 1996. 6. IPC Solder Products Value Council, “The
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. Aspandiar, “Voids in Solder Joints”, SMTAI Conference Proceedings, 2006. 5. D. Banks et al, “The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability”, Surface Mount International Conference, 1996. 6. IPC Solder Products Value Council, “The
| https://ipcapexexpo.org/education/call-for-technical-paper-form
Manufacturing Services Novel Solder Deposition Methods Process Best Practices Reflow Ovens and Profiling Rework Process Robotic, Laser and Selective Soldering Processes Stencil Printing Surface Mount Technology (SMT
| https://ipcapexexpo.org/education/call-for-participation
, Test and Inspection Accelerated Life Testing Automated Inspection (SPI, AOI, AXI) Solder Paste Inspection (SPI) Automated Optical Inspection (AOI
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/bondtesters?con=t&page=5
. Ribbon peel tests are mainly used for testing aluminum interconnects in microwave, high frequency,… SMD Shear Nordson DAGE Surface-mount devices (SMDs
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Training Provider / Events Organizer / Association / Non-Profit
6600 City W Pkwy
Eden Prairie, MN USA
Phone: 952-920-7682
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