| https://www.eptac.com/wp-content/uploads/2007/09/webinar_eptac_09_19_07-2.pdf
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/dies/cast-film-contour-dies
Significantly reduce scrapped materials by achieving acceptable product levels quicker than with a standard coathanger manifold die Improve product quality with lower levels of polymer degradation when
board’s acceptance in final assembly? Read Answer Piggy Backing of MELF Components (non-glass) Question: Is it acceptable to piggyback non-glass embodied MELF components per Class 3 of IPC-A-610
| https://www.eptac.com/wp-content/uploads/2020/01/eptac_webinar_02-19-20.pdf
. 6 7 How Does It Make Sense ? • What do I need to know? • Read the requirement, if the inspection meets the condition as it is written in the book, then it is acceptable, if it not as written in the book, then the conditions defined in the brackets apply
| https://www.eptac.com/blog/how-to-become-a-certified-ipc-specialist-cis
. It covers the acceptable and non-acceptable criteria for cable assemblies. Using 600 full-color illustrations, students learn the best practice for wire prep, crimping, ultrasonic welding, splicing, molding, lacing, and shielding among other valuable skills
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/news/news/2019-09-09
“well within acceptable levels,” according to Dipesh Patel, director. “In addition, while our old die needed about two hours after line startup to stabilize and start producing film with an acceptable level of gauge variation, the new EDI die stabilizes within only 15 or 20 minutes
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
+/- 0.10 mm difference between Most and Least density levels. PCB Libraries, Inc. has a philosophy that every chip size should have a unique Toe value that is aligned with J-STD-001 mathematical model for the acceptable solder joint
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
+/- 0.10 mm difference between Most and Least density levels. PCB Libraries, Inc. has a philosophy that every chip size should have a unique Toe value that is aligned with J-STD-001 mathematical model for the acceptable solder joint
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post12081.html
+/- 0.10 mm difference between Most and Least density levels. PCB Libraries, Inc. has a philosophy that every chip size should have a unique Toe value that is aligned with J-STD-001 mathematical model for the acceptable solder joint
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post12079.html
+/- 0.10 mm difference between Most and Least density levels. PCB Libraries, Inc. has a philosophy that every chip size should have a unique Toe value that is aligned with J-STD-001 mathematical model for the acceptable solder joint
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