| https://www.eptac.com/faqs/ask-helena-leo/ask/ipc-a-610-acceptable-requirements-for-nicks-and-chip-outs
IPC-A-610 Acceptable Requirements for Nicks and Chip-Outs - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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IPC-A-610 Acceptable Requirements for Nicks and Chip-Outs - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476
Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability 中文 MEMBERS LOGIN Membership Become a Member
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. Low-void IPC-7097A is the Specification for the Design and Assembly Process Implementation for BGAs. The inspection criteria for Ball Grid Array (BGA
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& A on Solder Resists and Conformal Coatings Defects: Lead Protrusion & Damaged Pins Looking for Training Products? SolderTraining.com can help. Email Optin SOLDERTIPS
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Hot Topics: Solder Mask Bubbles and Mask Flaking, Solder Balls, RoHS Cable Coating and More - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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Hot Topics: Solder Mask Bubbles and Mask Flaking, Solder Balls, RoHS Cable Coating and More - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
Assembly Process Implementation for BGAs. The inspection criteria for Ball Grid Array (BGA) and MicroBGA often call for voiding under 20%. A low-void solder paste is required to meet the very low-voiding limits for Class 3 assemblies. UV-traceable flux
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
) European Union Directive has significantly reduced the use of tin/lead surface finishes for component terminations. A reexamination of solder joint wetting of lead-free solders with the new component terminations is key to establishing thermal process profiles that ensure acceptable solder joint integrity
| https://www.eptac.com/soldertips/accept-or-reject-solder-contacting-component-bodies/
. Sections are shown below. Is this condition acceptable under any circumstances, or is it always a reject in all three classes? Answer: Based upon the requirements of IPC-A-610, solder is not allowed to touch a component body
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