| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
) and its compounds in some of their manufacturing operations, such as solder plating. This article aims to provide the reader some basic background information on the semiconductor industry's "lead-free" (Pb-free) initiatives
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
) and its compounds in some of their manufacturing operations, such as solder plating. This article aims to provide the reader some basic background information on the semiconductor industry's "lead-free" (Pb-free) initiatives
| https://pcbasupplies.com/koki-solder-wire-s03x7ca-72m-0-4-mm/
– 0.4 mm Anti Iron Tip Erosion Super Low Ag Flux Cored Wire Solder 72M series contain new and more active activator for improved wettability and new resin composition for better flux coverage
| https://pcbasupplies.com/koki-solder-wire-s03x7ca-72m-0-5-mm/
– 0.5 mm Anti Iron Tip Erosion Super Low Ag Flux Cored Wire Solder 72M series contain new and more active activator for improved wettability and new resin composition for better flux coverage
| https://pcbasupplies.com/koki-solder-wire-s03x7ca-72m-1-0-mm/
– 1.0 mm Anti Iron Tip Erosion Super Low Ag Flux Cored Wire Solder 72M series contain new and more active activator for improved wettability and new resin composition for better flux coverage
| https://pcbasupplies.com/koki-solder-wire-s03x7ca-72m-1-2-mm/
– 1.2 mm Anti Iron Tip Erosion Super Low Ag Flux Cored Wire Solder 72M series contain new and more active activator for improved wettability and new resin composition for better flux coverage
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Yoshinori Ejiri, Hitachi Chemical Co., Ltd. " The Wire Bonding Reliability of Electroless Ni/Pd/Au Plating Influence of Electroless Pd Deposition Reaction " View past award winners 2018 1st Place: Richard Coyle, Ph. D
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
-Pb alloy. There are a handful of alternative Pb-free alloys available on the market today, which are variations of Sn-Ag-Cu or Sn-Cu based alloys which have varying degrees of elemental additives such as nickel (Ni), germanium (Ge), bismuth (Bi
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Suthakaran, Russell Brush, Doug Perovic Abstract 31-1 Influence of Electroless Pd Plating Film Thickness on Solder Joint Relibility of ENEPIG Yoshinori Ejiri, Takehisa Sakurai, Yoshinori Arayama, Yoshiaki
