GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-solderpaste-lead.php
Lead Free Solder Paste Dispensing, Leaded Solder Paste Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
photomicrographs in Figure 13 show examples of solder joint failures (0/100 °C thermal cycling) in samples that were vacuum processed. These images show bulk solder cracking characteristic of thermal fatigue in SAC alloys. In the 192CABGA package, the failures occur
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
photomicrographs in Figure 13 show examples of solder joint failures (0/100 °C thermal cycling) in samples that were vacuum processed. These images show bulk solder cracking characteristic of thermal fatigue in SAC alloys. In the 192CABGA package, the failures occur
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296
performance under drop, shock and vibration loading conditions. Although SnAgCu (SAC) Pb-free solder alloys typically have better fatigue life than traditional eutectic SnPb solder, their fatigue reliability is limited at higher operating temperatures
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
solder ball attach for BGA) on TIMs voiding. Fig. 8 below shows an x-ray result after sTIM reflow, then after subsequent SAC reflow (details later). Fig. 8: Reflow#1 vs. Reflow#2 – same part In the case of Heller Industries, the task was to establish the
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
photomicrographs in Figure 13 show examples of solder joint failures (0/100 °C thermal cycling) in samples that were vacuum processed. These images show bulk solder cracking characteristic of thermal fatigue in SAC alloys. In the 192CABGA package, the failures occur
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305
