| http://etasmt.com/te_news_bulletin/2021-08-31/23574.chtml
• Improper solder volume due to improper stencil design • Paste viscosity too low • Paste metal content too low • Bad or expired solder paste
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23568.chtml
) • Misaligned solder mask (overlapping solder pad and print area) • Flux is too weak for the oxidation level of the board and/or components
| http://etasmt.com/te_news_bulletin/2021-08-31/23568.chtml
) • Misaligned solder mask (overlapping solder pad and print area) • Flux is too weak for the oxidation level of the board and/or components
| http://etasmt.com/te_news_bulletin/2019-08-05/9161.chtml
. In addition, if the viscosity of the solder paste is too low, and the solder paste slump is relatively poor, it is also a solder paste quality problem. (2
| http://etasmt.com:9060/te_news_industry/2019-05-28/6361.chtml
. If the viscosity is too high or too low, the printing quality will be affected. The storage environment of the solder paste requires the temperature to be maintained at 0-5 ° C
| http://etasmt.com/cc?ID=te_news_bulletin,11361&url=_print
vehicles.Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. Components became much smaller and component placement on both sides of a board became far more common with surface mounting than through-hole mounting, allowing much higher circuit densities and
| http://etasmt.com/te_news_bulletin/2019-10-21/11361.chtml
vehicles.Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. Components became much smaller and component placement on both sides of a board became far more common with surface mounting than through-hole mounting, allowing much higher circuit densities and
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23578.chtml
continuous and allows thermal profiles to be directly ported from non-vacuum reflow applications Continuous operation facilitates low cost of ownership (COO
| http://etasmt.com/te_news_bulletin/2021-08-31/23578.chtml
continuous and allows thermal profiles to be directly ported from non-vacuum reflow applications Continuous operation facilitates low cost of ownership (COO
| http://etasmt.com/cc?ID=te_news_bulletin,9561&url=_print
vehicles.Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. Components became much smaller and component placement on both sides of a board became far more common with surface mounting than through-hole mounting, allowing much higher circuit densities and
