| https://www.eptac.com/blog/leaded-vs-lead-free-solder-which-is-better
. Although, it is important to note that the amount of lead on solders is too insignificant to cause severe health problems. That being said, there is still a risk for workers to be exposed to lead during soldering
| http://etasmt.com/cc?ID=te_news_industry,5361&url=_print
order to form a good solder joint, if the solidification range is too wide, there may occur the solder joint cracking, easily cause Electronics damaged. 6, Low toxicity
| http://etasmt.com:9060/te_news_industry/2013-07-03/5361.chtml
order to form a good solder joint, if the solidification range is too wide, there may occur the solder joint cracking, easily cause Electronics damaged. 6, Low toxicity
| http://etasmt.com/te_news_industry/2013-07-03/5361.chtml
order to form a good solder joint, if the solidification range is too wide, there may occur the solder joint cracking, easily cause Electronics damaged. 6, Low toxicity
| https://www.smtfactory.com/What-is-the-function-of-the-temperature-and-humidity-sensor-in-Lyra-Reflow-Oven-id44562477.html
paste solder pre-allocated on the printed board pads. . This kind of Lyra Reflow Oven has a heating circuit inside, which heats air or nitrogen to a high enough temperature and blows it to the circuit board where the component is already attached, so that
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
• Improper solder volume due to improper stencil design • Paste viscosity too low • Paste metal content too low • Bad or expired solder paste
| http://etasmt.com:9060/te_news_industry/2021-08-31/23964.chtml
. Cool solder -- peak temperature is too low or time too short The peak temperature should be 20~25°C higher than the solder liquid point and remains there for 30~90 seconds. Cooling zone (below 217~220°C after reflow
| http://etasmt.com/te_news_industry/2021-08-31/23964.chtml
. Cool solder -- peak temperature is too low or time too short The peak temperature should be 20~25°C higher than the solder liquid point and remains there for 30~90 seconds. Cooling zone (below 217~220°C after reflow
| http://etasmt.com/te_news_bulletin/2021-08-31/23574.chtml
• Improper solder volume due to improper stencil design • Paste viscosity too low • Paste metal content too low • Bad or expired solder paste
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/heat-staking-systems?con=t&page=4
. When temperatures are too high the glass fibers come out of the plastic leading to a rough surface and sticking to the thermode. If the temperature is too low the plastic will crack due to cold deformation
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