Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
standard failure analysis techniques. A similar effect due to planar voiding was reported for mechanical reliability testing performed by Mukadam et al [10
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
standard failure analysis techniques. A similar effect due to planar voiding was reported for mechanical reliability testing performed by Mukadam et al [10
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
? Process Engineer, Garmin AT 2012 Xian Qin , Georgia Institute of Technology Paper: "Highly Reliable Low CTE Interposer to Printed Wiring Board SMT Interconnections" Where is she now
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. These gold alloys have a lower constant of thermal expansion (CTE) of 15 ppm/C compared with indium (32 ppm/C) so thermal mismatch strains are smaller
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. Figure 1 illustrates Aspandiar’s solder joint void classifications. Figure 1. Solder Joint Void Classifications [4] The following sections summarize published literature on the impact of voids in BGA solder joints found during the authors’ literature review. Study #1: D. Banks et al
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. Figure 1 illustrates Aspandiar’s solder joint void classifications. Figure 1. Solder Joint Void Classifications [4] The following sections summarize published literature on the impact of voids in BGA solder joints found during the authors’ literature review. Study #1: D. Banks et al
| 1 |
