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Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf

(in same plane as the TIM) area as a percent of the overall TIM coverage area. There is an increasing trend amongst solder TIM users towards both defining both a lower overall voiding (%max void total), and a maximum allowable void size or areal

Heller Industries Inc.

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