| https://ipcapexexpo.org/exhibitors/meeting-room-and-exhibitor-networking-functions
to the close of the event. What is allowed? You are always allowed to meet with your employees and customers. However, any function during the "official program" and event hours is prohibited
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1498&OB=DESC.html
Posted: 12 Dec 2014 at 11:21am Mixing hidden and missing pins is not allowed. It has to do with the format of the fpx library file. This part can be built in the FP Designer tho
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/hide-and-remove-pin-in-same-footprint_topic1498.html
-g6b.pdf Here, pins 2 and 5( or seven 7) are effectively hidden while the rest of the unused pins are removed (not counted). Is there a reason this flexibility will not be allowed
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1498&OB=ASC.html
-g6b.pdf Here, pins 2 and 5( or seven 7) are effectively hidden while the rest of the unused pins are removed (not counted). Is there a reason this flexibility will not be allowed
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1498&OB=DESC.html
Posted: 12 Dec 2014 at 11:21am Mixing hidden and missing pins is not allowed. It has to do with the format of the fpx library file. This part can be built in the FP Designer tho
| https://www.eptac.com/faqs/ask-helena-leo/ask/75-barrel-fill-requirement-for-class-2-change-in-j-std-001-revision-f
: Why did the IPC change the barrel fill requirement for Class 2 in J-STD-001 Revision F? Revision E allowed 50% when there was a thermal plane. Now, Rev. F states 75
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_to220-package-to-fp-designer_topic2446.xml
. I am unable to move it to FP Designer. Is there a reason why this wouldn't be allowed? Jeff
| https://www.eptac.com/ask/75-barrel-fill-requirement-for-class-2-change-in-j-std-001-revision-f/
: Why did the IPC change the barrel fill requirement for Class 2 in J-STD-001 Revision F? Revision E allowed 50% when there was a thermal plane. Now, Rev. F states 75
| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing. Have you ever seen this and if so, what is allowed or acceptable according to IPC standards, even with the lack of verified electrical failure of these components
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
. Have you ever seen this and if so, what is allowed or acceptable according to IPC standards, even with the lack of verified electrical failure of these components? Question
