25 alloy sac 305 profile results

 To define what degrees of solder alloy mixing exist on the reliability of SAC 305 BGA assembled with Sn/Pb eutectic solder paste

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf

Effect of Thermal Treatment on the Microstructure, Properties, and Reliability of Lead-Free Bismuth

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5052

: SMTA International Abstract:  A major reliability concern in the SMT industry is the reduction in reliability of lead-free solder alloys such as SAC 305 (Sn-3.0Ag-0.5Cu

Surface Mount Technology Association (SMTA)

Microsoft Word - pan_APEX06.doc

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf

), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305

Heller Industries Inc.

Microsoft Word - pan_APEX06.doc

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf

), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305

Heller Industries Inc.

Soldering Iron Tip Temperature - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/soldering-iron-tip-temperature

. These temperatures are satisfactory for all alloys, be it either the standard Sn/Pb or the new Lead-free alloys such as SAC 305 and Sn100C

Solder Selection for Printed Circuit Boards and Terminals - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-selection-for-printed-circuit-boards-and-terminals

. The alloys of SAC 305 and Sn100C will work together so mixing of those two should not be a problem. The concern, however; is the flux and can it be removed after the replacement of the component

. § Die size = 7, 10mm square § Liquidus peak = 250oC § Alloy type SAC 305 (217oC Melt Point) Test Results Void Ratio(Worst Case), [%] Sample Vacuum Level [torr] Dwell Time [sec] Worst Case [%] 1 5 30 0.21 2 5 120 0.39 3 10 30 0.36 4 10 60 0.26 5 20 30 0.20 6 20 60

46969 | https://hellerindustries.com/wp-content/uploads/2018/07/Inline-Vacuum-Reflow-System.pdf

Heller Industries Inc.

46969

. § Die size = 7, 10mm square § Liquidus peak = 250oC § Alloy type SAC 305 (217oC Melt Point) Test Results Void Ratio(Worst Case), [%] Sample Vacuum Level [torr] Dwell Time [sec] Worst Case [%] 1 5 30 0.21 2 5 120 0.39 3 10 30 0.36 4 10 60 0.26 5 20 30 0.20 6 20 60

46969 | https://hellerindustries.com/wp-content/uploads/2022/04/Inline-Vacuum-Reflow-System-1.pdf

Heller Industries Inc.

46969

Best Papers - Award Winners | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm

^ Best Student Paper The following paper was selected as the 2019 Best Student Paper. 2019: Faramarz Hadian, Binghamton University " Study Electromigration in SnBiAg / SAC(305) Mixed Solder Alloy " View past award winners 2018: Vishnu Reddy, Georgia Tech

Surface Mount Technology Association (SMTA)

Solder Selection for Printed Circuit Boards and Terminals - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/solder-selection-for-printed-circuit-boards-and-terminals/

. The alloys of SAC 305 and Sn100C will work together so mixing of those two should not be a problem. The concern, however; is the flux and can it be removed after the replacement of the component