Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5052
: SMTA International Abstract: A major reliability concern in the SMT industry is the reduction in reliability of lead-free solder alloys such as SAC 305 (Sn-3.0Ag-0.5Cu
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305
| https://www.eptac.com/faqs/ask-helena-leo/ask/soldering-iron-tip-temperature
. These temperatures are satisfactory for all alloys, be it either the standard Sn/Pb or the new Lead-free alloys such as SAC 305 and Sn100C
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-selection-for-printed-circuit-boards-and-terminals
. The alloys of SAC 305 and Sn100C will work together so mixing of those two should not be a problem. The concern, however; is the flux and can it be removed after the replacement of the component
46969 | https://hellerindustries.com/wp-content/uploads/2018/07/Inline-Vacuum-Reflow-System.pdf
Heller Industries Inc.
46969 | https://hellerindustries.com/wp-content/uploads/2022/04/Inline-Vacuum-Reflow-System-1.pdf
Heller Industries Inc.
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
^ Best Student Paper The following paper was selected as the 2019 Best Student Paper. 2019: Faramarz Hadian, Binghamton University " Study Electromigration in SnBiAg / SAC(305) Mixed Solder Alloy " View past award winners 2018: Vishnu Reddy, Georgia Tech
| https://www.eptac.com/ask/solder-selection-for-printed-circuit-boards-and-terminals/
. The alloys of SAC 305 and Sn100C will work together so mixing of those two should not be a problem. The concern, however; is the flux and can it be removed after the replacement of the component
