GPD Global | https://www.gpd-global.com/co_website/pdf/dispense/Dispensing-Systems-and-Pumps-Overview.pdf
. For sensitive applications, a laser surface sensor is available. The DS Series is versatile enough that the operator can change between a laser and contact surface sensor when applications demand it
GPD Global | https://www.gpd-global.com/pdf/dispense/Dispensing-Systems-and-Pumps-Overview.pdf
. For sensitive applications, a laser surface sensor is available. The DS Series is versatile enough that the operator can change between a laser and contact surface sensor when applications demand it
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/060922-precision-fluid-dispensing-systems-for-point-of-care-diagnostic-applications
. It also features laser height detection (see image below) to identify height variations and self-adjust accordingly for superior accuracy
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/conformal-coating-selection-guide
viscosities less than 100 centipoise. Coatings can be applied at line speeds up to ~750 mm/sec with single pass coverage. Even at this high speed, the edge definition remains sharp which allows for greater control in avoiding Keep Out Zones than is generally possible with an atomized spray process
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-substrate/
. Finally, the solder mask is applied on the surface, which is used primarily to protect the copper traced from oxidation, prevent solder bridges, and assist in visual inspections of the board
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. RMA 04D02 and RMA 07D02 rapid reflow solder pastes will not spatter when heated as quickly as 0.25 second. Typical reflow methods that achieve rapid reflow include laser, solder iron, hot bar, and induction
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
: "Assessments of Solder Joint Interconnection and Inner Package Interconnection (Via) Qualities for Improved Understanding of Chip to Package Interaction, Using Laser Ultrasonic Inspection Technique" Where is he now
KingFei SMT Tech | http://www.smtspare-parts.com/sale-10359799-n210056711aa-x01l51017h1-inside-moving-blade-a-i-parts-for-rhs2b-machine.html
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