Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
. Applications for which the (a) profile are appropriate include pastes that require a dwell time at 150° to 160°C to allow for flux activation, and for IR-based ovens that create large temperature differentials (∆T
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/00600-248-1.pdf
. Applications for which the (a) profile are appropriate include pastes that require a dwell time at 150° to 160°C to allow for flux activation, and for IR-based ovens that create large temperature differentials (∆T
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
/125 °C profiles. The key findings from the thermal cycling tests and subsequent failure analysis are as follows: ▪ X-ray and metallographic inspections showed that the solder paste was effective at producing extreme voiding in many of the ball locations
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
/125 °C profiles. The key findings from the thermal cycling tests and subsequent failure analysis are as follows: ▪ X-ray and metallographic inspections showed that the solder paste was effective at producing extreme voiding in many of the ball locations
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=2
. Nordson DAGE has been at the forefront of such testing since its… Nordson DAGE UV Curing App Note Nordson DAGE Bump Shear Nordson DAGE Nordson DAGE Bondtesters provide bump shear testing for use in the production test environment to remove the solder ball from a device or substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=4
. Stud bump pull testing is applicable where wire bonded stud bumps are used as an alternative to traditional flip chip bumps where shear testing would be applied
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=8
. Stud bump pull testing is applicable where wire bonded stud bumps are used as an alternative to traditional flip chip bumps where shear testing would be applied
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=7
Post Reflow with solder-ball diameter measurements from X-ray Inspection Nordson DAGE Test & inspection Solutions for SMT Manufacture Nordson DAGE Computerized Tomography Meets the Challenges of IC Package Inspection Nordson DAGE Nordson DAGE Awarded a Global Technology Award for Camera
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
/125 °C profiles. The key findings from the thermal cycling tests and subsequent failure analysis are as follows: ▪ X-ray and metallographic inspections showed that the solder paste was effective at producing extreme voiding in many of the ball locations
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
of the BEoL Region of a Flip Chip Package During Die Attach Process Zaeem Baig, Fahad Mirza, Hardik Parekh, Dereje Agonafer Abstract 27-2 Stencil and Solder Paste Inspection Evaluation for Miniaturized SMT Components Robert Farrell and Chrys Shea
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