| https://ipcapexexpo.org/education/call-for-technical-paper-form
) Process Surface Preparation Methods Vapor Phase Warpage-induced Defect Mitigation Other… Enter other… Circuit Design and Component Technologies Topics
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) Process Vapor Phase Warpage-induced Defect Mitigation PCB Fabrication and Materials 5G Additive and Semi-Additive Processes Black Pad and Other Board Related Defects CAF HDI Technology High Frequency
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
. Klein Wassink, Philips CFT, Holland "The Use of Nitrogen in Reflow Soldering" 1992: John Maxwell, JMA, Colorado "PC Board Design Techniques for Subminiature Chips" 1991: Dr
Surface Mount Technology Association (SMTA) | https://www.smta.org/certification/
. No other warranties or guarantees are expressed or implied. Industry-Recognized Instructors W. James Hall SMTA Processes Certification Instructor ITM Consulting Principal Consultant Over 35 years experience in electronic assembly technology Experience in developing Vapor Phase and Convection
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collector Directed development of solder hot water, home heating, and air conditioning systems HTC Corporation Directed development of first conveyorized SMT Vapor Phase reflow systems Directed development of conveyorized IR and convection reflow systems
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