25 au embrittlement in soldering results

? •  Gold embrittlement and voiding in SMT solder joints. •  Gold plated components falling off the board •  Evaluations exhibited Au-Sn intermetallic platelets distribute over the fracture surface and in the surface of the voids

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf

•  Evaluations exhibited Au-Sn intermetallic platelets distribute over the fracture surface and in the surface of the voids. Gold Embrittlement of Solder Joints By Ed Hare, Ph.D. Updated

| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf

Soudage sélectif

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/fr-fr/divisions/electronics-solutions/select-soldering

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J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal

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. Gold embrittlement is not a visually inspectable anomaly. In cases where analysis has determined there is a gold embrittlement condition, the gold embrittlement shall be considered a defect, see IPC-HDBK-001 or IPC-AJ-820 handbook for guidance

J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal - EPTAC - Train. Work

| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/

September, 2015 by Leo Lambert Recent Articles IoT and the Aerospace Industry – Too Risky? Leaded vs. Lead-Free Solder: Which is Better? The 5 Essential Tools for Soldering The Importance of IPC-A-610 Certification How to Build on Your Career in Soldering Categories Blog Uncategorized Why Get IPC Certified Gold and electronics have

J-STD-001E-2010: 4.5.1, Gold Removal Issues - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues

? Have you experienced RF component manufacturers that only offer SMT components with gold finish before? Does the concern of gold embrittlement take into account how much solder paste is being deposited in a surface mount solder joint? Answer

Call for Papers | ICEET

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/call_for_papers.cfm

: Lead-free assembly processes Lead-free die attach soldering Nano-scale soldering materials & processes New solder paste technologies Failure modes

Surface Mount Technology Association (SMTA)

Webinars - EPTAC - Train. Work Smarter. Succeed (2)

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: Critical Care of Soldering Tips in a Lead Free Environment Length: 25 Minutes Yes, we all know that you should be tinning your soldering iron tips between times of usage, but do you really understand the fundamentals of doing so, how it impacts heat transfer, time

10.6.1 Cleanliness flux Residues 7 Question #3 •  Flux residues are flux residues, regardless of whether they are burnt or not. •  The low solid content fluxes are designed to have the activators in the flux volatize off during the soldering operation and the residues left behind are benign

| https://www.eptac.com/wp-content/uploads/2016/08/eptac_08_17_16.pdf

10.6.1 Cleanliness flux Residues 7 Question #3 •  Flux residues are flux residues, regardless of whether they are burnt or not. •  The low solid content fluxes are designed to have the activators in the flux volatize off during the soldering operation and the residues left behind are benign

| https://www.eptac.com/wp-content/uploads/2021/11/eptac_08_17_16.pdf