12 au pb sn dissolution results

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Best Papers - Award Winners | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm

., Sandia National Laboratories "Sensitivity of Copper Dissolution to the Flow Behavior of Molten Sn-Pb Solder" 2013: Babak Arfaei, Ph.D., Universal Instruments Corporation "Effect of Sn Grain Morphology on Failure Mechanisms and the Reliability of Lead-Free Solder Joints in Thermal Cycling Tests" 2012

Surface Mount Technology Association (SMTA)

. The most important phases are AuSn4 and AuSn2 intermetallic compound phases. •  The embrittlement is the result of a large volume fraction of hard Au-Sn IMC platelets in the ductile Sn-Pb matrix

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 The control Sn-Pb/Sn-Pb assemblies showed better reliability than mixed memory assemblies 22 Experimental Results  The dissolution of Lead into the solder ball was not consistent across individual BGA components

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. • The embrittlement is the result of a large volume fraction of hard Au-Sn IMC platelets in the ductile Sn-Pb matrix. 12 Gold Embrittlement 13 Gold Embrittlement The data presented in these figures are from a theoretical calculation and have not been tested in practice but should be useful as a guide to avoiding

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:  Impact functionality  Impact reliability 5 Typical Metal Combinations to be Soldered  Cu to Cu  Cu to Sn/Pb  Pd to Sn/Pb  Au to Sn/Pb  Ag to Ag  Sn to Ni  SS to SS  SAC to Sn/Pb  ImAg to SAC  ImSn to Sn/Pb  ENIG to SAC & SnPb  Etc. 6 Flux Selection Process

| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf

:  Impact functionality  Impact reliability 5 Typical Metal Combinations to be Soldered  Cu to Cu  Cu to Sn/Pb  Pd to Sn/Pb  Au to Sn/Pb  Ag to Ag  Sn to Ni  SS to SS  SAC to Sn/Pb  ImAg to SAC  ImSn to Sn/Pb  ENIG to SAC & SnPb  Etc. 6 Flux Selection Process

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Shear Strength of Sn–0.3Ag-0.7Cu Solder/Cu Joint Mrunali Sona and K. Narayan Prabhu Abstract 28-2 Sensitivity of Copper Dissolution to the Flow Behavior of Molten Sn-Pb Solder P. T. Vianco, J. A. Rejent, A. C. Kilgo, and S. E. Garrett Abstract 28-1 SERDP

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) RBP (Carano) Consortia Test Programs IMEC/European Space Agency (Martin Cauwe’) SAIC/DoD “DOTC” Study (Carter) Development of Low Temperature Sn-Bi Based Pb-Free Solder Alloys

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628

Surface Mount Technology Association (SMTA)

40731

) RBP (Carano) Consortia Test Programs IMEC/European Space Agency (Martin Cauwe’) SAIC/DoD “DOTC” Study (Carter) Development of Low Temperature Sn-Bi Based Pb-Free Solder Alloys

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619

Surface Mount Technology Association (SMTA)

40731

US0683966

GPD Global | https://www.gpd-global.com/co_website/pdf/GPD-Global-CMRT-2021.xlsx

. Adjusted row spacing of misc cells to allow for different lengths of translated text and comments. 6. Removed the symbols for the metals on the standard smelter list (e.g., "Sn"). 7

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