| http://etasmt.com/te_news_bulletin/2021-08-31/23575.chtml
. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23575.chtml
. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder
Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth/
. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder
Heller Industries Inc. | https://hellerindustries.com/intermetallic-growth/
. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder
Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth
. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder
Heller 公司 | https://hellerindustries.com.cn/intermetallic-growth/
假焊 空洞 分层 组件开裂 金属间生长 无光泽焊点 × 属间化合物的生长 如果锡铅焊料粘附到含铅的铜上（通过电镀）和焊盘（通过热风或其他板式焊料涂覆方法），则形成锡铜金属间化合物. 通常是Cu6Sn5或Cu5Sn6，这种金属间化合物是导致焊料粘附到铜垫和引线上的原因. 在回流期间，通过添加锡铅焊料，金属间化合物会生长。对于其他板金属表面处理，会形成其他金属结构，例如将组件焊接到具有金光表面处理的板上时的AuSn (和锡铅焊料). 随着时间的流逝，金属间层不断增长. 它的生长速度取决于热漂移以及
Heller 公司 | https://hellerindustries.com.cn/intermetallics-growth
AuSn。 随着时间的推移，金属间层会增长。它的生长速度由热偏移和环境温度决定。金属间化合物的不幸特性之一是它比锡铅焊料或铜（或其他相关金属）更脆。随着时间的推移，随着金属间层变得越来越厚，它就完整性而言成为焊点的致命弱点。根据施加在组件和焊点上的应力，这通常最终会导致焊点开裂和失效。 通常，我们测量数月和数年的金属间化合物生长。然而，在回流过程中，由于高热偏移和锡铅处于熔融状态的事实，金属间生长有所加速。对于双面板，当A侧再次变成液相线时，金属间会进一步增长。如果有修复，修复系统的热量可以诱导正在返修
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