| http://etasmt.com/te_news_industry/2021-09-01/24163.chtml
homothermal period to solder melting and this rapid heating process has a close relationship with such defects as solder balls due to splash down and warped components due to imbalanced wettings on components
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
, David Braun Abstract 22-2 EFFECTS OF STORAGE PROCEDURES AND BAKE OUT ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS Paul Vianco, et al. Abstract 22-1 A CASE STUDY FOR TRANSITIONING CLASS A SERVER MOTHERBOARDS TO LEAD-FREE R
| 1 |
