Imagineering, Inc. | https://www.pcbnet.com/services/assembly/turn-key/
. With 18 nozzles in total, we are capable of mounting a vast mix of component types. Component baking – Our 8-zone reflow oven can meet all your component baking requirements
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
. Circuit board preparation - masking, baking and other process steps. BGA site preparation. Solder mask breakdown - how to prevent it, how to fix it
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/srt-training-calibration-and-certification
. Machine Operation and Profile Development. Circuit board preparation - masking, baking and other process steps. BGA site preparation
| https://www.eptac.com/faqs/ask-helena-leo/ask/ceramic-ccas-and-aqueous-wash-and-bake-out-prior-to-parylene-coating
. For example baking an FR-4 Board for 24 hours dries it out, but the moisture gets reabsorb within 8 hours, so quick processing is important
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/mixers/in-line-plastic-mixers
. Series 140 Disposable Plastic Tube Mixers Ideal for messy or short pot life adhesives, EFD Series 140 mixers’ low-cost, all-plastic assembly allows disposal of the mixer instead of solvent purging or baking. The
| https://www.eptac.com/ask/ceramic-ccas-and-aqueous-wash-and-bake-out-prior-to-parylene-coating/
. For example baking an FR-4 Board for 24 hours dries it out, but the moisture gets reabsorb within 8 hours, so quick processing is important
| http://etasmt.com/te_news_bulletin/2021-08-31/23574.chtml
. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. These largely relate around keeping sensitive equipment dry and protected from the environment. The best solution currently being used today is baking the components and carefully monitoring them to ensure that moisture is controlled
Heller Industries Inc. | https://hellerindustries.com/delamination/
. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
