Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
. The lateses processes, materials, equipment and techniques for rework of BGA, QFN, LGA, PoP and other SMD components. Key Topics Include: A review of the parameters for establishing a safe thermal profile
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
. Three surface finishes including OSP, ImAg, and ENIG are considered. The test vehicle consists of 15mm and 6mm Ball Grid Array (BGA) components. The assembled test boards were isothermally aged at 125oC for 12 months, which are then thermally cycled between -40oC to
Lewis & Clark | https://www.lewis-clark.com/product-category/pick-place/
“On The Fly” Vertical Alignment Upward Vision Camera for Fine Pitch Components and BGA Ball Inspection Max Feeder Capacity: (120) 8mm Feeders (Feeders available separately
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/srt-training-calibration-and-certification
! Course Description This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
microscopic Moiré interferometry. The CTE data for the PCB and the two BGA components are shown in Table 2 and Table 3. Table 2. The composite CTE of the PCB test vehicle fabricated with Panasonic R-1755V laminate measured using a thermomechanical analyzer (TMA
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
table 3. Fig. 12: Thermal profile used for vacuum and formic testing. Table 3: Formic concentration profile used for 4-5% peak formic test legs. G. High Pressure Reflow Tests A high pressure reflow oven is an autoclave. The sample is heated above its
Imagineering, Inc. | https://www.pcbnet.com/services/assembly/turn-key/
. We handle the whole process including ordering the components, PCB manufacturing, PCB assembly, testing and final shipment. We are capable of assembling BGA, Micro-BGA, QFN and other leadless package parts
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
microscopic Moiré interferometry. The CTE data for the PCB and the two BGA components are shown in Table 2 and Table 3. Table 2. The composite CTE of the PCB test vehicle fabricated with Panasonic R-1755V laminate measured using a thermomechanical analyzer (TMA
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
microscopic Moiré interferometry. The CTE data for the PCB and the two BGA components are shown in Table 2 and Table 3. Table 2. The composite CTE of the PCB test vehicle fabricated with Panasonic R-1755V laminate measured using a thermomechanical analyzer (TMA
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