Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
. Circuit board preparation - masking, baking and other process steps. BGA site preparation. Solder mask breakdown - how to prevent it, how to fix it
| https://www.eptac.com/faqs/ask-helena-leo/ask/silver-immersion-finish-boards
. Baking will impact the solderability of the board, especially if they are as stated immersion silver boards. My recommendation is to assemble a board, bake it for at least 8 hours and process it through the wave solder process
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/srt-training-calibration-and-certification
. Machine Operation and Profile Development. Circuit board preparation - masking, baking and other process steps. BGA site preparation
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
from the solder before it solidifies. Process and design-related causes: • Improper solder volume due to improper land design • Improper solder volume due to blocked stencil aperture
Imagineering, Inc. | https://www.pcbnet.com/services/assembly/turn-key/
. We handle the whole process including ordering the components, PCB manufacturing, PCB assembly, testing and final shipment. We are capable of assembling BGA, Micro-BGA, QFN and other leadless package parts
| https://www.eptac.com/ask/ceramic-ccas-and-aqueous-wash-and-bake-out-prior-to-parylene-coating/
: I have a question concerning ceramic CCA and their bake out after aqueous wash cycle prior to parylene coating. In theory, parylene deposition will draw off any moisture before the coating process
| https://www.eptac.com/faqs/ask-helena-leo/ask/ceramic-ccas-and-aqueous-wash-and-bake-out-prior-to-parylene-coating
: I have a question concerning ceramic CCA and their bake out after aqueous wash cycle prior to parylene coating. In theory, parylene deposition will draw off any moisture before the coating process
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. After identification, manufacturers can package, store, and handle devices to reduce thermal and mechanical damage during the reflow process
ASCEN Technology | https://www.ascen.ltd/Products/PCB_board_assembly_system/PCB_depaneling_/135.html
. * Surface white spray powder baking varnish is a special process, not easy to fall off Specification Item Scope of application Model number ASC-501 (no platform) ASC-502 (with 1.2M platform) ASC-503 (with 2.4M platform) Dimensions(L*W*H) 425*270*410mm 1200*506*333mm 2400*506
winsouce.jpg)