Partner Websites: baking table for bga components (Page 1 of 7)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys

Heller Industries Inc.

BGA Rework Training and Certification – Precision PCB Services, Inc.

Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training

.  The lateses processes, materials, equipment and techniques for rework of BGA, QFN, LGA, PoP and other SMD components. Key Topics Include: A review of the parameters for establishing a safe thermal profile

Precision PCB Services, Inc

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf

solder ball attach for BGA) on TIMs voiding. Fig. 8 below shows an x-ray result after sTIM reflow, then after subsequent SAC reflow (details later). Fig. 8: Reflow#1 vs. Reflow#2 – same part In the case of Heller Industries, the task was to establish the

Heller Industries Inc.

SRT Training, Calibration and Certification – Precision PCB Services, Inc.

Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/srt-training-calibration-and-certification

! Course Description This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components

Precision PCB Services, Inc

Full Turnkey Printed Circuit Board (PCB) Assembly | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/services/assembly/turn-key/

. We handle the whole process including ordering the components, PCB manufacturing, PCB assembly, testing and final shipment. We are capable of assembling BGA, Micro-BGA, QFN and other leadless package parts

Imagineering, Inc.

Dispense Machine Side-Attach Loader, Unloader

GPD Global | https://www.gpd-global.com/co_website/loader-unloader-operations.php

. They are easy to adjust and can hold a wide range of different magazine sizes. The Loader and Unloader can be adjusted quickly for magazine width, length, and height to process various products such as lead frames, BGA substrates, micro BGA strips, and singulated components in boats or fixtures

GPD Global

Dispense Machine Side-Attach Loader, Unloader

GPD Global | https://www.gpd-global.com/loader-unloader-operations.php

. They are easy to adjust and can hold a wide range of different magazine sizes. The Loader and Unloader can be adjusted quickly for magazine width, length, and height to process various products such as lead frames, BGA substrates, micro BGA strips, and singulated components in boats or fixtures

GPD Global

Dispense Machine Side-Attach Loader, Unloader

GPD Global | https://www.gpd-global.com/dispense-machine-side-attach.php

. They are easy to adjust and can hold a wide range of different magazine sizes. The Loader and Unloader can be adjusted quickly for magazine width, length, and height to process various products such as lead frames, BGA substrates, micro BGA strips, and singulated components in boats or fixtures

GPD Global

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

microscopic Moiré interferometry. The CTE data for the PCB and the two BGA components are shown in Table 2 and Table 3. Table 2. The composite CTE of the PCB test vehicle fabricated with Panasonic R-1755V laminate measured using a thermomechanical analyzer (TMA

Heller 公司

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

microscopic Moiré interferometry. The CTE data for the PCB and the two BGA components are shown in Table 2 and Table 3. Table 2. The composite CTE of the PCB test vehicle fabricated with Panasonic R-1755V laminate measured using a thermomechanical analyzer (TMA

Heller Industries Inc.

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