| https://unisoft-cim.com/view-markup_quoting_solder-joint-count-defect-per-million-operations-dpmo-report.html
. Next click QUOTE/QUALITY from the main menu then click SOLDER JOINT COUNT (DPMO) and the report appears. This report contains the total solder joints for the PC Board broken down by SMT and Thru Hole components, part numbers and package sizes. Example report: Report type
| https://unisoft-cim.com/view-markup_component-properties_changing-smd-and-thd.html
. There are 2 common methods to achieve this and they are outlined below. Method 1 — Editing the Object Properties CHANGING COMPONENT PROPERTIES FROM THRU-HOLE TO SURFACE MOUNT
GPD Global | https://www.gpd-global.com/co_website/ipc-apex-expo-2020.php
– Micro Volume Dispensing down to 150 µm Volumetric PCD pump with Controller – Volumetric dispense pump with total fluid control, great for viscosities 0-65,000 cps, Progressive Cavity Displacement Technology LIVE DEMOS - Thru-Hole Equipment Component Preparation for Through
GPD Global | https://www.gpd-global.com/ipc-apex-expo-2020.php
– Micro Volume Dispensing down to 150 µm Volumetric PCD pump with Controller – Volumetric dispense pump with total fluid control, great for viscosities 0-65,000 cps, Progressive Cavity Displacement Technology LIVE DEMOS - Thru-Hole Equipment Component Preparation for Through
| https://www.eptac.com/faqs/ask-helena-leo/ask/reliability-of-reworked-lead-free-assemblies
: Our current soldering process for a product proceeds like the following: two heat excursions, thru reflow, two thru a wave and one thru rework
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements? If not, how would we tin the gold plated components by wave soldering? Answer
| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements
| https://www.eptac.com/faqs/ask-helena-leo/page/6
: two heat excursions, thru reflow, two thru a wave and one thru rework. How many more rework cycles can we do before compromising the reliability of the
| https://www.eptac.com/faqs/ask-helena-leo/ask/ceramic-ccas-and-aqueous-wash-and-bake-out-prior-to-parylene-coating
. Do you have any information on the amount of absorption for ceramic CCA’s? Answer: I don’t have any information on the absorption capabilities of ceramic components
GPD Global | https://www.gpd-global.com/co_website/fluid-dispensing-systems-conformal-coating.php
& Conformal Coating Systems. We also manufacture SMT Cover Tape Peel Tester and Component Prep equipment for Thru-Hole applications. HOME Fluid Dispensing Application Solutions Fluid Dispense Systems Dispense Pumps Pump Integration Pump Accessories Product Brochure - English / 中文
