ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dage-announces-further-orders-for-its-unique-patented-hot-pin-pull-test-method
” testing which involves attaching a test probe to an individual solder ball with a controlled temperate / time profile. Once cooled the probe is subjected to a pull test which applies a test load that is symmetrical to the solder ball attach to the bonding pad
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/cold-bump-pull
. The jaws grip the solder ball without damaging the bonding area and applies a load that is virtually symmetrical to the area of attach, therefore applies a more uniform stress field to the ball
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=10
. The jaws grip the solder ball without damaging the bonding area and applies a load that is virtually symmetrical to the area of attach, therefore applies a more uniform stress field to the ball
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=9
. The jaws grip the solder ball without damaging the bonding area and applies a load that is virtually symmetrical to the area of attach, therefore applies a more uniform stress field to the ball
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=2
. The jaws grip the solder ball without damaging the bonding area and applies a load that is virtually symmetrical to the area of attach, therefore applies a more uniform stress field to the ball
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=1
. The jaws grip the solder ball without damaging the bonding area and applies a load that is virtually symmetrical to the area of attach, therefore applies a more uniform stress field to the ball
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sealant-equipment/applications/gluing-liquid-adhesive?con=t&page=8
: Gluing - Liquid Adhesive 093 No-Drip Two-Component Mini Dispense Valve Nordson SEALANT EQUIPMENT Dual Ball and Seat, Piston Actuated Material Valve Power Mixer Nordson SEALANT EQUIPMENT 041 Snuf-Bak
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and high flow applications 093 2-Part No-Drip Mini Series Nordson SEALANT EQUIPMENT Dual ball and seat, piston actuated valve for 2-part materials 060 Series No-Drip Fluid Control Valves Nordson SEALANT
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=7
. The jaws grip the solder ball without damaging the bonding area and applies a load that is virtually symmetrical to the area of attach, therefore applies a more uniform stress field to the ball
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sealant-equipment/products/two-component-2k-products-mixers?con=t&page=4
… 093 2-Part No-Drip Mini Series Nordson SEALANT EQUIPMENT Dual ball and seat, piston actuated valve for 2-part materials Battery Cell Bonding Applications Nordson SEALANT EQUIPMENT The bonding of
