Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
Procured specially prepared components with no lead metalization. Either tin, palladium silver or nickel. ♦ For BGAs, removed tin/lead balls and re-balled with tin/silver balls. ♦
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
Lead-Free Card Assembly and Test Process for a Server Complexity PCBA" 2006: Heather McCormick, Celestica, Inc., Canada "Mixing Metallurgy: Reliability of SAC Balled Area Array Packages Assembled Using SnPb Solder" 2005: Lars Boettcher, Fraunhofer IZM
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
provides a depth-adjustable image of the interfaces—showing voids, delamination and other interfacial defects. In fig. 5, the solder preform has melted and balled up before wetting: the negative (“smiley”) substrate deflection amounted to about 50% of the
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Soldering: Process Optimization for Simple to Highly Complex Boards Denis Barbini, Paul Wang, Peter Biocca, Quyen Chu, Abstract 20-2 MIXING METALLURGY: RELIABILITY OF SAC BALLED AREA ARRAY PACKAGES ASSEMBLED USING SnPb SOLDER Heather McCormick, Polina
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