Blackfox Training Institute, LLC | https://www.blackfox.com/4-common-errors-in-smt-assembly/
. Solder Balling As its name suggests, solder balling happens when tiny ball-like particles appear on the board. Much like solder bridges, solder balls could cause electrical disruptions, especially those big enough to connect two conductors
Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/4-common-errors-in-smt-assembly/
. Solder Balling As its name suggests, solder balling happens when tiny ball-like particles appear on the board. Much like solder bridges, solder balls could cause electrical disruptions, especially those big enough to connect two conductors
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_beamworks_spark400.html
Components Lead Free High Temperature Soldering Re-balling All types of BGA Flip-Chip & CSP Assembly Unique & special Applications Main Benefits
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_smt_pcb_selective_beamworks_spark400.html
Components Lead Free High Temperature Soldering Re-balling All types of BGA Flip-Chip & CSP Assembly Unique & special Applications Main Benefits
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
. BGA removal and replacement process. Inspection and interpreting x-ray results. BGA Re-Balling BGA pad Repair Flux Considerations for BGA's, LGA's and QFN's
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/srt-training-calibration-and-certification
. Equipment review BGA Re-Balling Optical Calibration Heater Testing and Calibration Certification Upon completing the course each student receives a certification from Precision PCB Services, Inc
| https://ipcapexexpo.org/education/call-for-technical-paper-form
2.5-D/3-D Component Packaging BGA Packaging Connectors Design for Excellence (DFX) Design for Manufacturability (DFM) Design for Test (DFT) Die attach Embedded Passive and Active Devices Flexible Circuits Flip Chip/0201 Metric Package on Package Printed Electronics RFID Circuitry Re-balling Components Semiconductor Wire Bonding Other
| https://ipcapexexpo.org/education/call-for-participation
2.5-D/3-D Component Packaging Package on Package Flip Chip/0201 Metric Re-balling Components Connectors Die attach Semiconductor Wire Bonding Ultra-thin die assembly BGA Packaging Quality, Reliability
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
Berlin "Integration of Active and passive Components Using Chip in Polymer Technology" 2004: Lars Boettcher, Fraunhofer IZM Berlin "Development of 3D-Redistribution and Balling Technologies for Fabrication of Vertical Power Devices" 2003: Dwayne Shirley
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
LEAD-FREE SMT PROCESSING Chrys Shea and Ranjit S Pandher Abstract 18-1 HOT AIR LEAD-FREE REWORK OF BGA PACKAGES & SOCKETS Alan Donaldson and Raiyo Aspandiar Abstract 18-1 DEVELOPMENT OF 3D-REDISTRIBUTION AND BALLING TECHNOLOGIES FOR FABRICATION OF
