| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf
Want to use more pictures in the exam Exam questions will be different from CIT and CIS programs Looks like we will be using 6012 and 6013 for the training program 7 Careful of Your Certificate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/screw-materials
. The flights should be hard surfaced with a nickel-based weld. New! Plasticating Essentials Handbook Screw, Barrel & Front-End Component Fundamentals We invite you to browse in the edition of our Plasticating Essentials Handbook, to give you an expert overview of screw, barrel and front-end component fundamentals
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. This paper discusses the work performed studying and comparing the Cu dissolution rates of various Pb-free alloys available on the market today. Although the use of a PCB with a nickel plated layer can reduce the occurrence of Cu dissolution, all
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/
) Next, the copper plating will be selectively removed from the substrate using a process known as etching. The process of etching looks like this
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. B Ball Grid Array (BGA) A surface-mount component containing a processor, and sometimes additional components, where the bottom has a grid of connection points with solder balls attached
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
) A surface-mount component containing a processor, and sometimes additional components, where the bottom has a grid of connection points with solder balls attached
| https://www.eptac.com/solder-tips/
: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
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