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PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size-does-not-scale-with-n-m-and-l_topic634.html
BGA Pad Size Does Not Scale With N, M and L? - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login BGA Pad Size Does Not Scale With N, M and L
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size-does-not-scale-with-n-m-and-l_topic634_page1.html
BGA Pad Size Does Not Scale With N, M and L? - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login BGA Pad Size Does Not Scale With N, M and L
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size-does-not-scale-with-n-m-and-l_topic634_post2158.html
BGA Pad Size Does Not Scale With N, M and L? - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login BGA Pad Size Does Not Scale With N, M and L
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-pad-size_topic2607_post10645.html
devices with less than 1.0mm pitch which (according to IPC) requires 10% reduction. 14.2.4 Attachment Site Planning The attachment site or land pattern geometry recommended for BGA devices is round with the diameter adjusted to meet contact pitch and size variation
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size_topic2607_post12477.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5193 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 22 Mar 2021 at 2:10pm Non-collapsing BGA balls are intended for fine pitch parts where a normal dog-bone via fanout cannot be achieved and you must use via-in-pad technology for this trace routing solution
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-pad-size_topic2607_post11390.html
devices with less than 1.0mm pitch which (according to IPC) requires 10% reduction. 14.2.4 Attachment Site Planning The attachment site or land pattern geometry recommended for BGA devices is round with the diameter adjusted to meet contact pitch and size variation