PCB Libraries, Inc. | https://www.pcblibraries.com/forum/3d-step-to-vrml_topic976&OB=DESC_page2.html
. Currently running 2013.04. Before purchasing the upgrade I had a go at the trial license which is still installed. It allows only output of BGA STEP files though, and as you say, these can be the larger ones
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/3d-step-to-vrml_topic976&OB=DESC_page2.html
. Currently running 2013.04. Before purchasing the upgrade I had a go at the trial license which is still installed. It allows only output of BGA STEP files though, and as you say, these can be the larger ones
| https://www.feedersupplier.com/sale-13067465-smd-led-khj-mc400-002-yamaha-24mm-smt-feeders.html
: YAMAHA Electric Feeder ZS 24MM Part No: KHJ-MC400-002 Compatibility: YS88/YS100/YSM10/YSM20/ YSM40R etc Condition: Original New Warranty:12months Stock: Only Original New is available for now
| http://www.feedersupplier.com/sale-13067465-smd-led-khj-mc400-002-yamaha-24mm-smt-feeders.html
: YAMAHA Electric Feeder ZS 24MM Part No: KHJ-MC400-002 Compatibility: YS88/YS100/YSM10/YSM20/ YSM40R etc Condition: Original New Warranty:12months Stock: Only Original New is available for now
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
: An Exercise in Technically Sound Cost Reduction Bruce M. Misner Abstract 29-3 Evaluation of Reworkable Edge Bond and Corner Bond Adhesives for BGA Applications Fei Xie, Han Wu, Kelley Hodge, Swapan K
| http://etasmt.com/cc?ID=te_news_industry,24567&url=_print
. lC pin pitch has developed to 0.5mm, 0.4mm, 0.3mm, BGA has been widely used, CSP has also emerged, and shows a rapid upward trend, no-clean, low-residue solder paste on materials has been widely used
| http://etasmt.com/te_news_industry/2021-09-01/24567.chtml
. lC pin pitch has developed to 0.5mm, 0.4mm, 0.3mm, BGA has been widely used, CSP has also emerged, and shows a rapid upward trend, no-clean, low-residue solder paste on materials has been widely used
| http://etasmt.com:9060/te_news_industry/2021-09-01/24567.chtml
. lC pin pitch has developed to 0.5mm, 0.4mm, 0.3mm, BGA has been widely used, CSP has also emerged, and shows a rapid upward trend, no-clean, low-residue solder paste on materials has been widely used
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/dispensing-fluids-general?ps=all
control of their dispensing processes with incredible functionality and flexibility, all within an easy-to-use interface Nordson ASYMTEK FluxPlus™ Paste Flux Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus is perfect for BGA
