GPD Global | https://www.gpd-global.com/fluiddispense-appsol-flipchipassembly.php
Contacts Technical Support About Company Profile News Events Awards Employment » Applications » Capillary Underfill Capillary Underfill Dispensing Typically Used for Silicon Die or BGA Applications in High Shock Environments or When Consistent Reliability is Required The Capillary Underfill
GPD Global | https://www.gpd-global.com/capillary-underfill-dispensing.php
Contacts Technical Support About Company Profile News Events Awards Employment » Applications » Capillary Underfill Capillary Underfill Dispensing Typically Used for Silicon Die or BGA Applications in High Shock Environments or When Consistent Reliability is Required The Capillary Underfill
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. This is particularly important if your boards feature BGA devices, QFNs, plated through holes or PTH through hole components. Ruby XL allows inspection of large backplane boards used in servers and for 5G
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
Best student presentation = $500 Abstracts are still being accepted! Acceptance Notification: May 2020 | Final Papers Due: July 24, 2020 When a paper is accepted by the Technical Committee, it is our expectation that you have budget approval for travel costs and conference registration which is required for speakers
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/lighting-and-led?con=t&page=3
. Modern LEDs are extremely bright, therefore generate heat which results in temperature increasingly becoming an issue. Heat stresses the die attach as well as the wire bond which causes displacement in the bulk of the moulding compound
| https://www.eptac.com/solder-tips/
: I have always had in the back of my head that burnt flux is a defect for all class 3 assemblies. Upon further review I have not been able to identify the specific section of the IPC-A-610F standard which identifies burnt flux as an acceptable or defect condition
| http://etasmt.com/cc?ID=te_news_industry,24361&url=_print
. by first pre-heating the components/PCB/solder paste to the soldering temperature, the flux will be activiate and move the oxidated surface of the PCB and SMC/SMD to let the
| https://www.smtfactory.com/ETA-GLOBAL-SERVICE-IN-EGYPT-id3204790.html
Router PCBA V-cutting Machine PCBA Coating Line Machine Belt Assembly Line X-ray / BGA SMT X-ray Machine BGA Rework Station Laser Making Machine SMT Peripheral Equipments Solutions LED Industry LED
| https://www.smtfactory.com/I-C-T-GLOBAL-SERVICE-IN-EGYPT-id3204790.html
Router PCBA V-cutting Machine PCBA Coating Line Machine Belt Assembly Line X-ray / BGA SMT X-ray Machine BGA Rework Station Laser Making Machine SMT Peripheral Equipments Solutions LED Industry LED
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. These factors result in different temperature delta crossing the board, which can sometimes be as high as 20 – 25°C. Moreover, larger components and thicker boards lead to a higher temperature delta across the board
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