PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size_topic2607_post12477.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5193 Post Options Post Reply Quote Tom H Report Post Thanks(1) Quote Reply Topic: BGA Pad Size Posted: 23 Jun 2022 at 7:52am Here is the BGA Pad Size Reduction table for Collapsing Balls
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-pad-size_topic2607_post11390.html
: 40 Post Options Post Reply Quote 5not4 Report Post Thanks(0) Quote Reply Topic: BGA Pad Size Posted: 27 Feb 2020 at 8:54am Tom. Can you explain how the tool calculates the footprint pad size for BGA's
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size_topic2607_post10649.html
: 40 Post Options Post Reply Quote 5not4 Report Post Thanks(0) Quote Reply Topic: BGA Pad Size Posted: 27 Feb 2020 at 8:54am Tom. Can you explain how the tool calculates the footprint pad size for BGA's
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=7
. First bond ball pull utilises cold bump pull jaw technology to apply a vertical load (a pull test) to ball bonds and stud bumps. Ball shear tests can sometimes promote pad cratering due to the aggressive nature of the bonding process which can weaken the ball bonds
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
: A total of 21 of 40 test vehicles had a void greater than 45% of solder ball diameter or 20% of ball area Solder crack path typically found at solder joint / BGA package interface Via in Pad (VIP
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
: A total of 21 of 40 test vehicles had a void greater than 45% of solder ball diameter or 20% of ball area Solder crack path typically found at solder joint / BGA package interface Via in Pad (VIP
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
mostly at the PCB side of the solder joints, with some fatigue crack initiation is found at the package side. Although package-side solder joint failures are typical in BGA thermal cycling experiments, PCB-side failures are known to occur with this
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
mostly at the PCB side of the solder joints, with some fatigue crack initiation is found at the package side. Although package-side solder joint failures are typical in BGA thermal cycling experiments, PCB-side failures are known to occur with this
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. B Ball Grid Array (BGA) A surface-mount component containing a processor, and sometimes additional components, where the bottom has a grid of connection points with solder balls attached
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Intermetallic Layer An intermediary layer of metal at the interface of solder and a wetted surface that is a mixture (alloy) of the solder metal and the base metals
