Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
mostly at the PCB side of the solder joints, with some fatigue crack initiation is found at the package side. Although package-side solder joint failures are typical in BGA thermal cycling experiments, PCB-side failures are known to occur with this
| https://www.eptac.com/wp-content/uploads/2013/08/eptac_08_21_13-1.pdf
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
) is targeting smaller for fine bump pitch, thus driving H/D value increasing. Fig. 1 is an illustration of the force balance at solder and metal pillar interface
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
CHARACTERIZE AND MITIGATE BGA PAD CRATERING IN PRINTED CIRCUIT BOARDS Mudasir Ahmad, Jennifer Burlingame, and Cherif Gui Abstract 2008 21-4 A Comprehensive Analysis of the Thermal Fatigue Reliability of SnPb and Pb Free Plastic Ball Grid Arrays (PBGA) Using
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/pcb-and-smt-assembly
. Failure Protection with Underfill Many large components, such as Package-on-Package (PoP), ball-grid arrays (BGA) and chip-scale packages (CSP
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. It is also helpful to understand any constraints that may exist. Some constraints at Dell’s EMs include the fact that nitrogen reflow was not widely available and no-clean solder flux was required
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