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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/2d-x-ray-inspection
. In many cases, X-Ray inspection (2D and 3D) provides the only non-destructive techniques to inspect optically hidden components and solder joints such as BGA, POP, QFN, flip chips, through holes, TSVs, micro-bumps, copper pillars, etc
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. Advances in X-ray Tube Technology Comparing Digital and Analogue X-ray Inspection of BGA, Flip Chip and CSP X-ray Dose Considerations In this Application Note, Dr Nick Dajda summarizes X-ray
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. Both manual and fully automatic testing solutions provide highest… Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE First
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems?con=t&page=9
about Nordson DAGE Test and Inspection systems Correlating the Presence of Popcorned BGA Devices Post Reflow with solder-ball diameter measurements from X-ray Inspection Nordson DAGE Ruby X-ray
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, performance and throughput. Products Content Sort Order: Featured Name A-Z Name Z-A XD7800NT Ruby XL The Solution for Large Board Applications X-ray Inspection Criteria
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Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Equipment Dealer / Broker / Auctions
Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea
Phone: +82-1029254936
