Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis
| https://ipcapexexpo.org/education/call-for-participation
Call for Participation | IPC APEX EXPO 2021 Skip to main content Toggle navigation Attendee Menu Schedule e-Brochure Schedule at a Glance Full Program Schedule Agenda Planner Attendee Planner Demo Exhibitor New Product Demos
| https://ipcapexexpo.org/education/call-for-technical-paper-form
Call for Participation: Technical Paper | IPC APEX EXPO 2021 Skip to main content Toggle navigation Generic Menu for Web Forms Home Schedule Show Info Call for Participation
| https://www.eptac.com/faqs/soldertips?hsLang=en
: I have always had in the back of my head that burnt flux is a defect for all class 3 assemblies. Upon further review I have not been able to identify the specific section of the IPC-A-610F standard which identifies burnt flux as an acceptable or defect condition
| https://www.eptac.com/faqs/soldertips
: I have always had in the back of my head that burnt flux is a defect for all class 3 assemblies. Upon further review I have not been able to identify the specific section of the IPC-A-610F standard which identifies burnt flux as an acceptable or defect condition
| https://www.eptac.com/solder-tips/
: I have always had in the back of my head that burnt flux is a defect for all class 3 assemblies. Upon further review I have not been able to identify the specific section of the IPC-A-610F standard which identifies burnt flux as an acceptable or defect condition
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
the defect may have occurred. Modern 2D / 3D X-ray Inspection - Emphasis on BGA, QFN, 3D Packages and Counterfeit Components - A high level overview of the capabilities of 2D X-ray for inspecting BGA and QFN device attachment
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/application/smt
. QFN Device Test and Inspection Common Process Defect Identification of QFN Packages - Wie man QFN-Bauteile mit Röntgeninspektion prüft. Real Time X-ray Analysis of Void Formation and Dynamics in QFN Devices During Reflow - Leistungsstarke Geräte
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