| http://etasmt.com/cc?ID=te_news_bulletin,15961&url=_print
. If there is a BGA, the peak temperature should be set within 240 to 260 degrees and maintained for about 40 seconds. In addition, it should be noted that in the reflow area, the reflow soldering time should not be too long, so as not to cause damage to the furnace, or cause the PCB board to be scorched or the component malfunctions
| http://etasmt.com/cc?ID=te_news_industry,23961&url=_print
High Speed High Density Open Pin Field Array, has up to 500 I/O contact pins with a solder charge termination. This type of connector looks like a standard BGA type of SMT device
| http://etasmt.com:9060/te_product_j/2019-09-26/6428.chtml
. Draco622 8 zone reflow oven first-class heating module, 2 cooling zones ensure proper cooling of the printed circuit board after soldering
| http://etasmt.com/te_product_g/2019-11-04/7429.chtml
. 2 cooling zones ensure proper cooling of the printed circuit board after soldering. Content LED Reflow Soldering Oven Machine ❙ Introduce of SMD Oven 8 hearting zones reflow oven, OEM SMT reflow soldering oven for LED PCB production
| http://etasmt.com/te_product_j/2019-09-26/6428.chtml
. Draco622 8 zone reflow oven first-class heating module, 2 cooling zones ensure proper cooling of the printed circuit board after soldering
Heller Industries Inc. | https://hellerindustries.com/searchqueries/
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Lewis & Clark | http://www.lewis-clark.com/product-tag/rework-station/
: Standard Onyx 29 Automated Assembly Linear Air Knife Air Cooling System Fume Extraction (as depicted in photos below) Automated Component Pick up Shuttle Workstation DRS Custom with CPU Stand Dispenser
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
. SMT Board HEAT MODULE TOP COOLING MODULE 63” (1600 mm) 134.00” (3404 mm) 72” 13” PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 9 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 1 Tin Silver, BGA 230
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
. SMT Board HEAT MODULE TOP COOLING MODULE 63” (1600 mm) 134.00” (3404 mm) 72” 13” PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 9 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 1 Tin Silver, BGA 230
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. This is particularly important if your boards feature BGA devices, QFNs, plated through holes or PTH through hole components. Ruby XL allows inspection of large backplane boards used in servers and for 5G
