PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic797&OB=DESC.html
. The Lead Span, Pin Pitch, Pin Qty, Lead Width & Length, Ball Size, Thermal Tab size, Lead tolerance. The only exceptions to this rule is the component Height becasue it affects the 3D model name and BGA because Memory Chips have the same package size for various memory limits, 4GB, 8GB, 16GB, 32GB, etc. i.e
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/multiple-same-footprint-name_topic797_post2882.html
. The Lead Span, Pin Pitch, Pin Qty, Lead Width & Length, Ball Size, Thermal Tab size, Lead tolerance. The only exceptions to this rule is the component Height becasue it affects the 3D model name and BGA because Memory Chips have the same package size for various memory limits, 4GB, 8GB, 16GB, 32GB, etc. i.e
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/multiple-same-footprint-name_topic797_post2903.html
. The Lead Span, Pin Pitch, Pin Qty, Lead Width & Length, Ball Size, Thermal Tab size, Lead tolerance. The only exceptions to this rule is the component Height becasue it affects the 3D model name and BGA because Memory Chips have the same package size for various memory limits, 4GB, 8GB, 16GB, 32GB, etc. i.e
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic797&OB=DESC.html
. The Lead Span, Pin Pitch, Pin Qty, Lead Width & Length, Ball Size, Thermal Tab size, Lead tolerance. The only exceptions to this rule is the component Height becasue it affects the 3D model name and BGA because Memory Chips have the same package size for various memory limits, 4GB, 8GB, 16GB, 32GB, etc. i.e
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/multiple-same-footprint-name_topic797&OB=DESC_page1.html
. The Lead Span, Pin Pitch, Pin Qty, Lead Width & Length, Ball Size, Thermal Tab size, Lead tolerance. The only exceptions to this rule is the component Height becasue it affects the 3D model name and BGA because Memory Chips have the same package size for various memory limits, 4GB, 8GB, 16GB, 32GB, etc. i.e
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/multiple-same-footprint-name_topic797_post2898.html
. The Lead Span, Pin Pitch, Pin Qty, Lead Width & Length, Ball Size, Thermal Tab size, Lead tolerance. The only exceptions to this rule is the component Height becasue it affects the 3D model name and BGA because Memory Chips have the same package size for various memory limits, 4GB, 8GB, 16GB, 32GB, etc. i.e
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems?con=t&page=9
about Nordson DAGE Test and Inspection systems Correlating the Presence of Popcorned BGA Devices Post Reflow with solder-ball diameter measurements from X-ray Inspection Nordson DAGE Ruby X-ray
| https://www.feedersupplier.com/sale-13119444-smt-machine-spare-partpcb-8-way-und-connection-siplace-smt-pcb-assembly-production-line-siemens.html
: Electronic Equipment Condition: Used Brand: Siemens/Siplace Quality: 100% Strictly Tested Package: Carton Package Usage: SMT Pick And Place Machine Port
| http://www.feedersupplier.com/sale-13119444-smt-machine-spare-partpcb-8-way-und-connection-siplace-smt-pcb-assembly-production-line-siemens.html
: Electronic Equipment Condition: Used Brand: Siemens/Siplace Quality: 100% Strictly Tested Package: Carton Package Usage: SMT Pick And Place Machine Port
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/biomaterial-delivery-devices?con=t&page=31
Jet Valve Cleaning station for mechanically cleaning the exterior of dirty nozzle plates. USB Connector Testing Application Note 2019 Nordson DAGE Correlating the Presence of Popcorned BGA Devices Post Reflow with solder-ball diameter measurements from X-ray Inspection Nordson DAGE
