QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/mlbrs-650-automatic-bga-rework-station-221932?page=59&order=list_price+asc
Automatic BGA Rework Station | Qinyi Electronics Co.,Ltd × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products Automatic BGA Rework Station Public Pricelist Public
| https://www.eptac.com/webinar/ipc-7095c-the-definitive-source-for-everything-bga/
IPC-7095C – The Definitive Source for Everything BGA | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
| https://www.eptac.com/webinars/ipc-7095c-the-definitive-source-for-everything-bga/
IPC-7095C – The Definitive Source for Everything BGA - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/webinars/ipc-7095c-the-definitive-source-for-everything-bga
IPC-7095C – The Definitive Source for Everything BGA - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/pages/refund-and-refund-policy
. Any item not in its original condition, is damaged or missing parts for reasons not due to our error. Any item that is returned more than 30 days after delivery Refunds (if applicable
| https://www.eptac.com/webinar/addressing-the-issues-around-solder-joint-voids-in-surface-mount-components/
. Review of IPC-A-610 criteria for BGA and SMT components. Samples of x-ray images and what they are saying to us. List of papers and studies on the topic for further review. Course Length: 20 Minutes Cost: FREE Presenter(s
| https://www.eptac.com/webinars/addressing-the-issues-around-solder-joint-voids-in-surface-mount-components/
: Selecting the Right Flux for Your Application Q & A on Solder Resists and Conformal Coatings Defects: Lead Protrusion & Damaged Pins Key Tips
| https://www.eptac.com/webinars/addressing-the-issues-around-solder-joint-voids-in-surface-mount-components
. Review of IPC-A-610 criteria for BGA and SMT components. Samples of x-ray images and what they are saying to us. List of papers and studies on the topic for further review
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=10
. The cold bump pull test method is required as traditional shear testing tends to deform the solder ball during the test such that the area of attach can become damaged during the process
| https://www.smtfactory.com/High-Speed-SMT-AOI-Machine-in-PCB-Board-Off-Line-Model-I-C-T-V8-pd48670624.html
. LOG automatic collecting and storage function,NG warning/alarm function, Remote programming&debugging. 2. Inspection ability:insufficient,short,slodering hole,solder covering pin,contamination,misalignment,missing part,skewed,billboard,mounting on side,overturn,wrong part,damaged,float,polarity,pseudo soldering,empty solder,excessive glue etc. 3
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