| http://etasmt.com:9060/te_news_industry/2021-09-01/24567.chtml
. lC pin pitch has developed to 0.5mm, 0.4mm, 0.3mm, BGA has been widely used, CSP has also emerged, and shows a rapid upward trend, no-clean, low-residue solder paste on materials has been widely used
| http://etasmt.com/te_news_industry/2021-09-01/24567.chtml
. lC pin pitch has developed to 0.5mm, 0.4mm, 0.3mm, BGA has been widely used, CSP has also emerged, and shows a rapid upward trend, no-clean, low-residue solder paste on materials has been widely used
| http://www.thebranfordgroup.com/DNN3/Auction/DZSF0323.aspx
) Martin Repair BGA Repair Rework Station Denon Instruments DIC Rework SNC100C Solder New (28) 25-Lb Boxes X-Ray / AOI’s: Fein Focus FXS-160.40 X-Ray Phoenix X-Ray Pcbal Analyzer
| http://www.thebranfordgroup.com/dnn3/Auction/DZSF0323.aspx
) Martin Repair BGA Repair Rework Station Denon Instruments DIC Rework SNC100C Solder New (28) 25-Lb Boxes X-Ray / AOI’s: Fein Focus FXS-160.40 X-Ray Phoenix X-Ray Pcbal Analyzer
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/2d-x-ray-inspection
‑ray inspection systems are key tools for quality control, yield enhancement, and failure analysis of PCBs and semiconductor devices
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