ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/peter-koch-of-nordson-dage-will-discuss-failure-analysis-with-x-ray-at-eteks-technology-event
. Also, Koch will discuss how the shape of the BGA balls or the voiding can give a good indication of the failure. The presentation will analyze failures on different components such as resistors, capacitors and wire bonds
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-pad-size_topic2607_post10645.html
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BGA Pad Size - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login BGA Pad Size
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. Statistical T-Test for Solder Joint Voiding Showing Indistinguishable Failure Populations [7] Study #4: S. Sethuraman et al, “The Effect of Process Voiding on BGA Solder Joint Fatigue Life Measured in Accelerated Temperature Cycling” [8
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. Statistical T-Test for Solder Joint Voiding Showing Indistinguishable Failure Populations [7] Study #4: S. Sethuraman et al, “The Effect of Process Voiding on BGA Solder Joint Fatigue Life Measured in Accelerated Temperature Cycling” [8
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