| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding
. Can you give me some background on this issue, as we are trying to determine the root cause of this problem? Answer: IMC Microvoids, as defined in IPC-7095C Design and Assembly Process Implementation for BGAs, on page103. In the section
| https://www.eptac.com/ask/problems-with-pcb-micro-voiding/
. Can you give me some background on this issue, as we are trying to determine the root cause of this problem? Answer: IMC Microvoids, as defined in IPC-7095C Design and Assembly Process Implementation for BGAs, on page103. In the section
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
: An Exercise in Technically Sound Cost Reduction Bruce M. Misner Abstract 29-3 Evaluation of Reworkable Edge Bond and Corner Bond Adhesives for BGA Applications Fei Xie, Han Wu, Kelley Hodge, Swapan K
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. The solubility of nickel in the indium is very low so diffusion-controlled growth of the intermetallic (IMC) layer is slow. On exposure to air, nickel forms a unsolderable oxide on its surface, so it is protected with a flash coating of gold. In
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
(Note that in SnPb solder joint, Cu6Sn5 present at the interface between SnPb solder and the Cu pad) and Ag3Cu intermetallic compound (IMC
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
(Note that in SnPb solder joint, Cu6Sn5 present at the interface between SnPb solder and the Cu pad) and Ag3Cu intermetallic compound (IMC
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