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響と比較することを目指した定量分析は行われていません。 この研究では、大基板対応 CT の技術を定評ある接合強度試験シェアの手法と併用して、シェア テストで測定された接合強度を、大基板対応 CT で判定されたボイディングのサイズおよび位置と相関させることを目指しました。確かな統計的有意性を確認するため、膨大な数の PCB に取り付けられた BGA デバイスを利用しました。 またプロセスを加速させるため、ボンドテスターと X 線の両方による測定にさまざまなレベルの自動化が採用されました。 Flextronics と Nordson DAGE は、共同で“Optimizing X-ray Inspection with Package on Package
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Hwaseong-si, Gyeonggi-do, Korea
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Phone: +82-1029254936
