ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=13
: First Bond Ball/Stud Bump Pull Modern 2D / 3D X-ray Inspection - Emphasis on BGA, QFN, 3D Packages and Counterfeit Components Nordson DAGE 3 Point Bend Fixture Datasheet Nordson DAGE Explorer one
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-semiconductor
. Products Content Sort Order: Featured Name A-Z Name Z-A Jade Plus High quality X-ray inspection for production applications. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking… Quadra™
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-semiconductor?page=1
. Products Content Sort Order: Featured Name A-Z Name Z-A Jade Plus High quality X-ray inspection for production applications. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking… Quadra™
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1009-pbga-delaminations
, Through Transmission - Application Note 1009 Sample & Method These 4 plastic BGA packages were imaged simultaneously by the THRU-Scan technique at 15 MHz
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/x-ray
. Advances in X-ray Tube Technology Comparing Digital and Analogue X-ray Inspection of BGA, Flip Chip and CSP X-ray Dose Considerations In this Application Note, Dr Nick Dajda summarizes X-ray
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/tweezer-peel?con=t&page=8
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/hot-bump-pull?con=t&page=10
) Devices during Assembly and Inspection Nordson DAGE X-Ray / Bondtester Reliability Study of BGA Devices – Impact of Interfacial Voiding Nordson DAGE First
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/courtyard-roundoff_topic2380_post10021.html
: 65 Post Options Post Reply Quote Batiskaff Report Post Thanks(0) Quote Reply Topic: Courtyard Roundoff Posted: 03 Sep 2018 at 2:03am In BGA: The Courtyard Place Round-off default setting is 0,10 mm In QFP
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/courtyard-roundoff_topic2380_post9765.html
. Go to " Preferences > Terminals > SM Grid Array's > BGA, LGA or CGA " and there are tables for the various Lead Diameter's and each one has a separate Courtyard Excess
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/courtyard-roundoff_topic2380_post10021.html
: 65 Post Options Post Reply Quote Batiskaff Report Post Thanks(0) Quote Reply Topic: Courtyard Roundoff Posted: 03 Sep 2018 at 2:03am In BGA: The Courtyard Place Round-off default setting is 0,10 mm In QFP
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Equipment Dealer / Broker / Auctions
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Phone: +82-1029254936
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